Product Description

Complete LTE Physical & Protocol Layers for Macrocell & Microcell base stations on SDR, DSP or ASIC platforms

• 3GPP release 8 compliant
  • MAC, RLC, PDCP, RRC, S1AP, X2AP, GTP-U, SCTP
• Number of supported users scalable and depending on HW platform
  • Macrocell & Microcell 50-1000 users
  • Pico 64-128 user
  • Femto 8-32 users
• Round-Robin demo scheduler integrated, other schedulers optional
• Quality of service supporting all QoS profiles
• Support of trace collection, trace compression and trace group activation throughout all layers

Key Features

• miInfraPHY^TM 3GPP Fully Compliant LTE PHY
• mi!InfraSTACK^TM 3GPP Fully Compliant LTE MAC, RLC, PDCP, RRC, S1AP, X2AP, GTP-U, SCTP, RRM, SON & ANR
• 3GPP compliant (Rel-8.7, June-09)
• FDD with normal cyclic prefix (CP)
  • TDD optional
• Dual TX and RX antennas
• Bandwidths 5 / 10 / 20 MHz
• Category 1-4 support
  • Cat. 5 optional
• All DL Channels (PDSCH, PDCCH, PBCH, PCFICH, PHICH, PSS/SSS)
  • SISO and all MIMO modes
  • (transmit diversity, large delay CDD, closed loop spatial multiplexing)
  • DL Power Control
  • All resource allocation types (including virtual resource blocks)
• All UL Channels (PUSCH, PRACH, PUCCH, SRS)
  • All hopping modes included
  • Interference estimation
  • HARQ control
  • Channel estimation and timing measurement
• Physical Multicast Channel Optional
• Support of Femto Forum Scheduler API
• Standardized interface, easy integration of 3rd party scheduler
• Support of Femto Forum L1 API
• Standardized interface, easy integration with 3rd party STACK/PHY
• Support of Network Monitoring Mode API
• (active R&D, later releases)
• Support for interference management and SON
• Network Monitoring Mode
• Radio Resource Management

Specification

Platforms

Texas Instruments are the world leading supplier of high performance DSPs for wireless infrastructure. mimoOn’s mi!InfraPHY™ software has been integrated on TI’s TMS320TCI648X highly flexible, scaleable processors targeting LTE products.

TI’s 648X series processors allow equipment manufacturers the advantages of design and code reuse, since the processors can be scaled to meet both the intensive processing demands of macro basestations, as well as the new generation of LTE Base Stations.

mimoOn offers the 3GPP LTE Stack software package mi!InfraSTACK™ for many types of stack processors. The implementation is in ANSI C/C++ and is suitable to be ported to a wide variety of embedded Processors, and can also be used for simulation on a PC platform.

CEVA Inc are a leading licensor of DSP IP cores. CEVA-XC™ is a high-performance, low-power DSP processor designed and optimized for advanced wireless communications processing in mobile handsets as well as wireless infrastructure applications. A single CEVA-XC core is capable of handling complete 3.5G and 4G transceiver paths of in software. As a fully programmable architecture CEVA-XC supports multiple air interfaces including LTE, WiMAX, HSPA, alongside 3G and 2G in software. mi!InfraPHY™, mimoOn’s advanced software for UEs, is implemented on CEVA’s XC323 processor and can handle real-time use cases for LTE such as streaming HD video using 64QAM and 5MHz channels.

Tensilica® Inc., are a leader in efficient dataplane processor (DPU) IP cores for advanced mobile wireless & infrastructure SOCs (system-on-chips). Tensilica’s ConnX Baseband Engine (BBE) and Atlas LTE Reference designs will be available with mimoOn’s mi!InfraPHY™ software.

Tensilica’s ConnX BBE based wireless radio platform enables efficient baseband processing for 3G, LTE and 4G wireless equipment. The combination of Tensilica’s optimized high-performance DSPs (digital signal processors) and controllers integrated in a single DPU platform provides designers with the ability to make the right tradeoffs between size, power and programmability to meet the challenging needs of the next generation radios.

Tensilica's Xtensions Partner Program brings its LTE (Long Term Evolution) baseband handset and base station design customers a robust infrastructure of top-tier  partners in SOC (system-on-chip) design-critical areas such as LTE physical layer software solutions, system level modeling, real time operating systems emulation, and design services.